LAM RESEARCH 853-054147-001 Etch System Liquid Pump Upgrade
853-054147-001LAM RESEARCH 853-054147-001 chemical delivery liquid pump replacement for etch systems. Compatible upgrade, 12-month warranty, fast global shipping from Xiamen.
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The Lam Research 853-031764-001-A-1997 RF Bias Electrode Chuck is a precision OEM spare part engineered for sustained plasma process stability in semiconductor fabrication environments. Whether you are managing a scheduled preventive maintenance cycle, responding to an unplanned chamber shutdown, or building a strategic spare parts inventory for your Versys, Exelan, or 2300 Series etch systems, this component delivers the dimensional accuracy, material integrity, and electrical performance required to restore full chamber operation with minimal downtime.
Cross-reference part numbers for this assembly include A0384140, A0378622, 0020-31035, and 0040-09263, ensuring compatibility verification across multiple Lam Research internal revision records and procurement databases. Each unit supplied by TOPNLMS is sourced from verified OEM channels, individually inspected prior to dispatch, and covered by a 12-month warranty.
| Parameter | Specification |
|---|---|
| Part Number | 853-031764-001-A-1997 |
| Cross-Reference | A0384140 / A0378622 / 0020-31035 / 0040-09263 |
| Component Type | RF Bias Electrode Chuck |
| Compatible Platform | Lam Research Versys, Exelan, 2300 Series Etch Systems |
| Application | Plasma Etch Chamber — Wafer Bias Electrode Assembly |
| Material | Anodized Aluminum / Ceramic Composite (OEM Grade) |
| Operating Environment | High-vacuum plasma process chamber; cleanroom-compatible |
| Electrical Function | RF bias distribution to wafer substrate during etch process |
| Weight | Approx. 2,600 g |
| Origin | United States (OEM) |
| Condition | Original / Refurbished-to-OEM-spec (state at order) |
| Warranty | 12 Months from date of shipment |
| Pre-shipment Testing | Electrical continuity, dimensional inspection, visual QC |
| Lead Time | Typically 3–7 business days; expedite available |
In high-throughput semiconductor fabs and research facilities, the RF bias electrode chuck is a wear-critical component that directly governs etch uniformity, wafer-to-wafer repeatability, and chamber matching performance. A degraded or failed electrode chuck manifests as process drift, increased particle counts, or asymmetric etch profiles — all of which trigger costly unscheduled downtime and yield loss.
When scheduling a planned replacement of the 853-031764-001-A-1997 electrode chuck, experienced process engineers and equipment technicians routinely extend the maintenance window to inspect and, where necessary, replace adjacent components that share the same wear cycle or failure mode. The RF match network assembly and bias RF cable harness should be inspected for impedance drift and connector wear, as degraded RF delivery directly stresses the electrode chuck. The focus ring and edge ring — consumables that sit concentrically around the chuck — typically require replacement at the same interval and should be sourced simultaneously to avoid a second chamber opening within weeks.
The electrostatic chuck (ESC) power supply module and its associated DC bias filter board are worth bench-testing during the same downtime event; a marginal ESC supply can cause intermittent chucking failures that are often misdiagnosed as electrode chuck degradation. Similarly, the helium backside pressure control valve and He leak check assembly should be verified, as backside gas integrity is essential for wafer temperature uniformity during etch.
At the chamber level, the upper electrode assembly (showerhead) and its gas distribution insert should be visually inspected for erosion and deposition buildup. The chamber liner and confinement ring are additional consumables that, if approaching end-of-life, are best replaced during the same scheduled outage to maximize mean time between maintenance events. Finally, the process kit O-ring set — including all chamber body and lid seals — should be replaced as a matter of course whenever the chamber is opened to atmosphere, preventing vacuum integrity issues that would otherwise require a repeat pump-down and leak check cycle.
Coordinating the procurement of these related components alongside the 853-031764-001-A-1997 electrode chuck allows maintenance teams to complete a comprehensive chamber restoration in a single planned outage, dramatically reducing the cumulative downtime cost compared to piecemeal reactive replacements.
The 853-031764-001-A-1997 RF Bias Electrode Chuck addresses one of the most common challenges in legacy Lam Research system lifecycle management: maintaining process-qualified chambers beyond the OEM’s active support window. As Lam Research transitions its service focus toward newer platform generations, procurement of critical spare parts for Versys and Exelan systems through authorized third-party channels becomes the primary strategy for extending system operational life.
TOPNLMS supplies this part as a direct OEM replacement, preserving full dimensional and electrical compatibility with the original chamber design. No process re-qualification is required when replacing a like-for-like OEM part, which means your chamber can return to production immediately after installation and standard chamber conditioning. This is a significant advantage over aftermarket alternatives, which may require extended process re-qualification and recipe adjustment — both of which consume valuable production time.
For facilities managing multiple Versys or Exelan chambers, maintaining a minimum stock of one spare 853-031764-001-A-1997 electrode chuck per chamber cluster is a widely adopted best practice. This inventory posture eliminates the lead-time risk associated with emergency procurement and ensures that any unplanned chamber event can be resolved within a single shift rather than over multiple days of expedited logistics.
The cross-reference compatibility of this part across revision codes A0384140, A0378622, 0020-31035, and 0040-09263 also simplifies spare parts consolidation for facilities that have historically maintained separate part number records for functionally identical assemblies, reducing inventory complexity and carrying cost.
Q1: Is the 853-031764-001-A-1997 compatible with both Versys and Exelan platform variants?
Yes. The 853-031764-001-A-1997 RF Bias Electrode Chuck is compatible with Lam Research Versys, Exelan, and 2300 Series etch chamber configurations. Cross-reference part numbers A0384140, A0378622, 0020-31035, and 0040-09263 confirm interchangeability across these platform variants. If you require compatibility verification for a specific chamber serial number or configuration, please contact our technical team before ordering.
Q2: What pre-shipment testing is performed on each unit?
Every unit undergoes electrical continuity verification, dimensional inspection against OEM drawings, and visual quality control for surface condition and connector integrity before dispatch. A test record is available upon request. Units are packaged in ESD-safe, cleanroom-compatible materials to prevent contamination or damage in transit.
Q3: What does the 12-month warranty cover, and how is a claim processed?
The 12-month warranty covers manufacturing defects and OEM-specification non-conformance identified under normal operating conditions. It does not cover damage resulting from improper installation, process excursions, or physical mishandling. To initiate a warranty claim, contact TOPNLMS with your order number, a description of the failure mode, and photographic documentation. Replacement or credit is typically processed within 5 business days of claim approval.
Q4: How should I plan spare parts inventory for long-term Versys/Exelan system support?
For facilities operating 2 or more Versys or Exelan chambers, we recommend maintaining at least one spare 853-031764-001-A-1997 electrode chuck on-site at all times, alongside a full process kit (focus ring, edge ring, O-ring set, and chamber liner). This inventory posture supports a same-shift response to any unplanned chamber event and eliminates emergency freight costs. TOPNLMS can support blanket purchase orders and scheduled delivery programs for high-volume or multi-site customers.
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