Product Overview
TEL DS1105-200260-12 Replacement for Trias/Telius CVD: Smooth Transition & Legacy System Compatibility
The TOKYO ELECTRON DS1105-200260-12 Shutter Base — cross-referenced as N1410200103, AN141003, 0050-97418, 0050-97417, and 0051-04424 — is a precision mechanical component engineered for the TEL Trias and Telius CVD and Etch process chambers. As semiconductor fabs worldwide face the challenge of sustaining aging TEL platforms no longer covered under active OEM service contracts, sourcing a verified, drop-in replacement for the DS1105-200260-12 has become a critical procurement priority for process engineers and maintenance teams managing legacy tool fleets.
This shutter base assembly governs the mechanical isolation of the process chamber during wafer transfer sequences. Its dimensional accuracy, surface finish, and material compatibility directly affect chamber integrity, particle performance, and process repeatability. A worn or cracked shutter base can cause vacuum seal degradation, cross-contamination between process zones, and unplanned downtime that disrupts wafer throughput across the entire cluster tool. For fabs running 24/7 production schedules, even a single unplanned chamber vent caused by a failed shutter base can translate into significant yield loss and schedule disruption.
Our replacement DS1105-200260-12 is manufactured to OEM-equivalent dimensional tolerances, inspected against the original TEL engineering drawing references, and validated for direct installation without modification to the existing chamber hardware or transfer robot alignment parameters. Each unit undergoes dimensional verification, surface finish inspection, and fit-check before release, ensuring that field engineers can install the part with confidence during a planned PM window or an emergency repair event.
Compatibility Comparison Table
| Parameter |
OEM Reference (TEL) |
TOPNLMS Replacement |
| Primary Part Number |
DS1105-200260-12 |
DS1105-200260-12 (Drop-in) |
| Cross-Reference SKUs |
N1410200103 / AN141003 / 0050-97418 / 0050-97417 / 0051-04424 |
All cross-references supported |
| Compatible Platform |
TEL Trias, TEL Telius |
TEL Trias, TEL Telius (all chamber generations) |
| Process Application |
CVD / Etch Chamber Shutter Mechanism |
CVD / Etch Chamber Shutter Mechanism |
| Installation Type |
OEM Direct Mount |
Direct replacement — no modification required |
| Interface Compatibility |
TEL standard chamber bolt pattern & locating pin positions |
Matched to OEM bolt pattern and alignment features |
| Material Specification |
Anodized aluminum / precision machined |
OEM-equivalent alloy and surface treatment |
| Weight |
~1,450 g |
1,450 g (verified) |
| Robot Realignment Required |
N/A |
Not required under standard installation |
| Recipe / Parameter Change |
N/A |
None — mechanical component only |
| OEM Service Status |
Discontinued / Limited OEM availability |
In stock — ready to ship |
| Warranty |
OEM warranty (if applicable) |
12-Month Warranty from shipment date |
Seamless Upgrade Solutions
Replacing the DS1105-200260-12 Shutter Base is rarely an isolated event. In most TEL Trias and Telius retrofit and legacy-system-upgrade scenarios, process engineers simultaneously evaluate adjacent components to restore full chamber performance and extend the productive life of the cluster tool. During a planned preventive maintenance window — or an unplanned shutter failure event — it is standard practice to inspect and replace the TEL Trias transfer chamber slit valve assembly, which operates in close mechanical coordination with the shutter base and is subject to similar wear cycles under repeated vacuum cycling.
The TEL Telius process kit — including the chamber liner, focus ring, and edge ring — is frequently refreshed in the same maintenance interval, since shutter base degradation often correlates with elevated particle counts that indicate broader chamber wear. Engineers working on the CVD stack also commonly address the TEL DS1105-series gas distribution plate and the showerhead assembly, both of which interact with the shutter zone during deposition cycles and benefit from simultaneous inspection when the chamber is already vented.
For facilities managing a multi-chamber Trias configuration, the TEL robot blade and end-effector assembly should be inspected whenever shutter base replacement is performed, as misalignment between the transfer robot and a worn shutter base is a leading cause of wafer handling faults and edge exclusion drift. The TEL Trias loadlock door seal kit and associated O-ring replacement set are also standard co-procurement items, since vacuum integrity across the loadlock-to-transfer-chamber interface depends on the combined condition of all sealing surfaces — and a chamber vent is the ideal opportunity to address all of them in a single maintenance event.
Facilities operating legacy TEL Telius Etch tools frequently source the TEL upper electrode assembly and focus ring retainer alongside the shutter base, particularly when transitioning from OEM service contracts to third-party maintenance programs. The TEL Trias chamber body heater cartridge and associated thermocouple assembly round out the typical bill of materials for a comprehensive chamber refurbishment, ensuring that thermal uniformity is restored alongside mechanical integrity after the shutter base swap. Procurement teams managing multi-tool fleets often consolidate these co-requisite parts into a single purchase order to minimize freight costs and reduce the number of vendor qualification events required under their AVL management process.
Retrofit Guidance FAQ
Q: Is the DS1105-200260-12 a direct drop-in replacement without chamber realignment?
A: Yes. The replacement part is machined to OEM dimensional specifications, including the bolt circle, locating pin positions, and mating surface flatness. No realignment of the transfer robot or chamber geometry is required under standard installation conditions. Engineers should verify the slit valve actuator travel after installation as a precautionary step per TEL maintenance procedure.
Q: Will this replacement affect our existing CVD process recipe or Etch endpoint parameters?
A: No. The shutter base is a mechanical isolation component and does not interact with RF power delivery, gas flow control, or plasma parameters. Process recipes stored in the TEL Trias or Telius controller do not require modification following shutter base replacement.
Q: Is the part compatible with both the Trias and Telius platform variants?
A: The DS1105-200260-12 is referenced across both the TEL Trias and TEL Telius chamber configurations. Customers should confirm the specific chamber generation and shutter actuator type against their maintenance documentation before ordering, as minor sub-variants exist across tool generations.
Q: What is the typical installation time, and does it require a full chamber vent?
A: Shutter base replacement requires a full chamber vent to atmosphere and a standard pump-down and leak-check sequence before returning to process. Typical installation time for an experienced field engineer is 4–8 hours, including chamber conditioning and qualification wafer runs.
Q: Can this part replace cross-reference numbers 0050-97418, 0050-97417, and 0051-04424?
A: Yes. These cross-reference numbers — including N1410200103 and AN141003 — are all associated with the same shutter base assembly used across TEL Trias and Telius chamber configurations. Our replacement covers all listed cross-references.
Q: What documentation is provided with the shipment?
A: Each unit ships with a dimensional inspection report, a material certificate of conformance, and a warranty certificate. Customs documentation for international shipments is prepared in accordance with HS code requirements for semiconductor equipment parts originating from China.
Q: How do I handle the transition from OEM service to third-party maintenance for my TEL tool fleet?
A: We recommend beginning with a full spare parts audit against your current TEL Trias or Telius BOM, identifying all discontinued or long-lead OEM part numbers. TOPNLMS can support this process by providing availability and lead time information for high-demand components, allowing your maintenance team to build a strategic buffer stock that reduces exposure to unplanned downtime during the OEM-to-third-party transition period.
Warranty Assurance
Every TOPNLMS replacement part — including the DS1105-200260-12 Shutter Base — is covered by a 12-Month Warranty from the date of shipment. Our pre-shipment inspection protocol includes dimensional verification against OEM reference drawings, surface finish inspection, and functional fit-check where applicable. Units that fail to meet specification are quarantined and not released for sale.
In the event of a warranty claim, TOPNLMS provides a replacement unit or full refund within the warranty period, subject to inspection of the returned part. Our after-sales response target is 24 hours for initial acknowledgment and 72 hours for resolution proposal. We maintain buffer stock of high-demand TEL Trias and Telius components to support rapid replacement dispatch without extended lead times.
For procurement teams managing approved vendor lists (AVL) or requiring supplier qualification documentation, we can provide company registration certificates, quality management system documentation, and export compliance records upon request. All shipments originate from Xiamen, China, with DHL Express, FedEx International Priority, and sea freight options available depending on urgency and order volume.
We understand that unplanned downtime in a semiconductor fab carries significant financial consequences. Our inventory management and logistics infrastructure are designed to support emergency procurement scenarios with same-day or next-business-day dispatch for in-stock items. Every order is tracked from dispatch to delivery, with proactive communication on customs clearance status for international shipments.